供资
股票销售中的Powerlatice 融资 86M, SEC 存档显示
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Powerlatice Technologies Inc已经出售了111,010万美元股票报价中的86,009,965美元，根据2026年10月30日向美国证券交易委员会备案的华盛顿温哥华公司免予报价的表格D通知。 该公司正在为AI处理器开发一个动力输送芯片，它报告了2026年10月15日的首次发售日期。
提供条件和投资者
该通知称，报价总额为111 010 000美元，已售出86 009 965美元，尚有25 000 035美元待售。 证券是股本，发行人要求根据规则506(b)豁免，即通常用于未经证监会登记私人安置的D条例安全港。 已有18个投资者投资，所有投资者都获得认证；备案没有列出未经认证的投资者，没有最低投资额，也没有销售佣金或发现者费用。
提交书是新的备案，而不是对先前通知的修正。 2026年10月30日公司联合创始人兼首席执行官彭祖 signed签字，证监会的备案记录显示该机构在上午9:56接受。 那天的时间备案还表明，该提议不会超过一年。
发行商是2023年成立的特拉华州公司，其地址列为203 SE Park Plaza Drive, Suite 210，位于华盛顿温哥华，其产业集团被授予"其他科技". 该公司拒绝披露一个收入范围。 备案名称为邹，苏吉思·德马尔和江任担任执行官和导演，史蒂夫·傅，帕特·格尔辛格和文希赫担任导演。
较早的供资和创始小组
Powerlatice于2025年11月17日从偷盗中出现，宣布由Playground Global和Celesta Capital联合领衔的2500万美元系列A轮和称，当时其至今拥有3100万美元的融资。 几个月前，该公司根据其EDGAR的备案历史，提交了前两份免责报价通知，日期分别为2025年5月23日和2025年5月27日，其中还记录了该公司早先的名称为PowerLattice Technologies Inc.
Powerlatice由邹，江任和Sujith Dermal创立，自称是一家无线半导体公司，创始团队的经验跨越Qualcomm,NUVIA和Intel以及集成磁学，模拟IC，电力管理和系统设计。 与A系列合作，Pat Gelsinger是Playground Global的总合伙人，Steve Fu博士是Celesta Capital的合伙人，加入董事会。 公司总部位于华盛顿州温哥华；其隐形公告在亚利桑那州钱德勒新增了一间办公室，其2026年10月的发行也上市了加利福尼亚州圣何塞。
芯片技术和10月示范
公司的产品是它所称的行业的第一电源输送芯片：一个集成电压调节器，即IVR，直接建在处理器包中，以垂直向处理器输送负载点功率。 Powerlatice描述了一个Rainier微IVR架构，该架构结合了它的PowerMagix微型化的在迭代磁性插管，控制电路创新，它称之为可编程电源阵列同步，以及可编程的软件层，它声称与传统的母板供电相比，是功率噪声的减速令。
公司称AI加速器和GPU每芯片推力超过2000瓦，声称其方法将总的计算功率需求减少了50%以上——称在固定数据中心动力预算下可以将其转化为2X或更多原始性能提升。
2026年10月26日，Powerlatice 宣布成功演示了它所描述的行业首个单晶体IVR芯片，将控制器，电源晶体管和插管集成为单晶体管。 在演示中，芯片为Powerlatice开发的高精度硅设备提供动力，以模仿下一代AI加速器当前需求的广泛负载和快速变化。
“将负载点发电直接纳入处理器包，我们给予设计者灵活性，使其电力输送能够适应处理器，无论是使用单个的IVR芯片还是同步阵列，”Zou 称在演示公告中。
截止其2025年11月的隐形公告，称公司手头有硅，GPU,CPU和加速器的工程样本在进行中，绘图超过1000瓦。
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Funding
Powerlattice Raises $86M in Equity Offering, SEC Filing Shows
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Powerlattice Technologies Inc has sold $86,009,965 of a $111,010,000 equity offering, according to a Form D notice of exempt offering the Vancouver, Washington-based startup filed with the U.S. Securities and Exchange Commission on October 30, 2026. The company, which is developing a power delivery chiplet for AI processors, reported a date of first sale of October 15, 2026.
Offering Terms and Investors
The notice reports a total offering amount of $111,010,000, with $86,009,965 already sold and $25,000,035 remaining to be sold. The securities are equity, and the issuer claimed the exemption under Rule 506(b), the Regulation D safe harbor commonly used for private placements without SEC registration. Eighteen investors had already invested, all of them accredited; the filing lists no non-accredited investors, no minimum investment amount, and no sales commissions or finders’ fees.
The submission is a new filing rather than an amendment to an earlier notice. It was signed by Peng Zou, the company’s co-founder and chief executive, on October 30, 2026, and SEC filing records show the agency accepted it at 9:56 a.m. Eastern Time that day. The filing also indicates the offering is not intended to run for more than one year.
The issuer is a Delaware corporation incorporated in 2023, with its address listed as 203 SE Park Plaza Drive, Suite 210, in Vancouver, Washington, and its industry group given as Other Technology. The company declined to disclose a revenue range. The filing names Zou, Sujith Dermal and Gang Ren as executive officers and directors, and Steve Fu, Pat Gelsinger and Wen Hsieh as directors.
Earlier Funding and Founding Team
Powerlattice emerged from stealth on November 17, 2025, announcing a $25 million Series A round jointly led by Playground Global and Celesta Capital, and said at the time that it had raised $31 million in funding to date. Months earlier, the company had filed two previous notices of exempt offering, dated May 23, 2025 and May 27, 2025, according to its EDGAR filing history, which also records the company’s earlier name styling as PowerLattice Technologies Inc.
Powerlattice was founded by Zou, Gang Ren and Sujith Dermal and describes itself as a fabless semiconductor company, with a founding team whose experience spans Qualcomm, NUVIA and Intel as well as integrated magnetics, analog IC, power management and system design. With the Series A, Pat Gelsinger, a general partner at Playground Global, and Dr. Steve Fu, a partner at Celesta Capital, joined the board. The company is headquartered in Vancouver, Washington; its stealth announcement listed an additional office in Chandler, Arizona, and its October 2026 release also listed San Jose, California.
Chiplet Technology and October Demonstration
The company’s product is what it calls the industry’s first power delivery chiplet: an integrated voltage regulator, or IVR, built directly into the processor package to deliver point-of-load power vertically to the processor. Powerlattice describes a Rainier micro-IVR architecture that combines its PowerMagix miniaturized on-die magnetic inductors, control circuit innovations it calls Programmable Power Array synchronization, and a programmable software layer, and it claims an order-of-magnitude reduction in power noise compared with conventional motherboard power delivery.
The company says AI accelerators and GPUs are pushing past 2,000 watts per chip, and claims its approach reduces total compute power needs by more than 50% — a reduction it says can translate into 2X or more raw performance uplift under a fixed data center power budget.
On October 26, 2026, Powerlattice announced the successful demonstration of what it described as the industry’s first monolithic IVR chiplet, which integrates the controller, power transistors and inductors into a single chiplet. In the demonstration, the chiplet supplied power to a high-precision silicon device that Powerlattice developed to emulate the wide-ranging loads and rapid changes in current demand of next-generation AI accelerators.
“By integrating point-of-load power delivery directly into the processor package, we give designers the flexibility to tailor power delivery to their processors, whether using an individual IVR chiplet or a synchronized array,” Zou said in the demonstration announcement.
As of its November 2025 stealth announcement, the company said it had silicon in hand and engineering samples in progress for GPUs, CPUs and accelerators drawing more than 1,000 watts.
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