AI 模型和平台
Celestica 发布 DS6005 人工智能数据中心的组合光学交换机
在 Google 上的首选来源中添加 Unite.AI
Celestica 推出 the DS6005，一个完全液冷的数据中心开关，可提供最多102.4个 2026年10月12日公司公告中，通过同装光学显示容量的Tbps. 系统建立在Broadcom的Tomahawk 6 – Davisson开关芯片上，Celestica在2026年OCP全球峰会(英语：2026 OCP Global Summit in San Jose)上展示了它，该峰会于2026年10月12日至15日举行。
位于多伦多的公司将DS6005描述为围绕带宽密度，功率，耐久性，以及达到下一代AI数据中心网络要求而设计的共包光学(CPO)切换系统。 Celestica 称开关是专为AI和机器学习放大和扩展的网络而专门建造的，它能降低功耗，降低耐久性，提高下一代AI集群的集群效率和可靠性。
Gavin Cato, Celestica的组合解决方案和AI平台工程的资深副总裁兼总经理，称 AI的基础设施驱动着对带宽的需求，而电力、热管理、耐用性和影响力则日益成为重要的制约因素。 “DS6005 带来在紧凑平台上共同包装的光学、液体冷却、实地可替换的外部激光模块以及CPO-aware软件管理，旨在帮助客户制造可伸缩和节能的AI织物，”Cato 称。
DS6005 硬件和设计
DS6005将其光学发动机直接安装在交换机ASIC包上，而不是使用常规的前座式可插座光学。 Celestica 称共同包装的布局旨在帮助数据中心操作员优化带宽密度，降低空闲度，提高电源效率。 该公司上市了64个港口，其中1.6TbE提供了该系统的102.4Tbps切换能力，称为OCP ORV3机架设计了完全液冷的1.5OU附件，提高了温度稳定性和可靠性，同时提高了整体机架密度。 该开关还支持SONiC,Celestica 称使得在经过验证的开放架构上生产的时间更快。
DS6005产品页列出AMD Ryzen x86 CPU与Broadcom TH6-Davisson芯片并列。 64型光学互联通过16x4x MMC-16连接器运行，系统还搭载了1个100GbE QSFP28端口，RJ45控制台和波外GbE管理端口，1个USB 3.0 A型端口，1个USB-C控制台端口，以及16个用于外部激光模块的ELSFP接口。 该单元符合ORv3-HPR架规格。
在产品页面Celestica 称上，开关会减少链接的功耗，提供超低的延迟，相对于重时光学减少延迟。 页面名称为AI和机器学习扩增和扩增网络，高性能计算，前沿云和企业域AI模型，以及作为系统最优化的部署类型的超尺度云基础设施。
Broadcom的Tomahawk 6 — — 戴维森硅
Broadcom 宣布于2025年10月8日表示它正在运送Tomahawk 6 – Davisson，这是它的第三代CPO以太网开关，它称这是该行业第一个交付102.4Tbps光学启用的开关能力。 对于BCM78919设备，Broadcom列出了16台Davisson DR光学发动机，每台6.4Tbps,200Gbps每个链路带宽，场可替换的ELSFP激光模块，以及支持512个XPU的扩容集群以及10多万个双层网络中的XPU，每个链路200Gbps. 根据Broadcom的说法，芯片符合IEEE 802.3，并且与现有的400G和800G标准互操作。
Broadcom 称 TH6-Davisson将基于TSMC的COUPE技术的光学发动机与高级底板级多芯片包装融合在一起，并报告光学互联电能消耗下降70%，这一水平被描述为比传统的插接解决方案低3.5倍以上。 卡托在2025年的公告中提供了一份支持性声明，称芯片的光学集成，功率效率和性能符合Celestica的下一代AI基础设施和工作量部署策略。
支持声明和峰会显示
在Broadcom的光学系统分部担任营销和运营的副总裁Manish Mehta，称将联合包装的光学从高级建筑转移到生产准备系统，这需要硅、光学发动机、包装、热设计、制造和系统集成之间的协作。 Mehta 称 Celestica的系统工程和平台执行帮助将Broadcom的技术转化为高密度AI织物设计的平台。
称 AI网络正在将限制从计算转移到周围的有形基础设施，Boujelbene将共同包装的光学描述为该行业应对这些挑战的重要途径之一，而称可插接、近包装和共同包装的方法将继续随着生态系统的成熟而共存。
Alan Weckel,650 Group的创始人和技术分析师，称联合包装的光学正在从一个产业主题转向生产用于AI网络，在受控的高密度规模外织物中有一个重要的近期机会。 Cliff Grossner，开放计算项目基金会首席创新官，称跨硅光子，硬件，软件的开放合作，以及管理，对于构建可伸缩，互操作的AI织物至关重要，可大规模部署和支持。
Celestica 称将在2026年OCP全球峰会上将DS6005展出，开放计算项目基金会将于2026年10月12-15日在加利福尼亚州圣何塞举行。 基金会的活动网页上说，2026年的峰会已经售罄，注册被关闭，现场注册不会提供。 Celestica引导读者浏览其活动登陆页，了解更多有关其参加2026年10月15日结束的峰会的信息。
本文由 AI图鉴自动抓取并翻译，版权归原作者所有；如需查看原文请点下方链接。
AI Models & Platforms
Celestica Unveils DS6005 Co-Packaged Optics Switch for AI Data Centers
Add Unite.AI to your preferred sources on Google
Celestica introduced the DS6005, a fully liquid-cooled data center switch that delivers up to 102.4Tbps of capacity through co-packaged optics, in a company announcement dated October 12, 2026. The system is built on Broadcom’s Tomahawk 6 – Davisson switch chip, and Celestica is showcasing it at the 2026 OCP Global Summit in San Jose, which runs October 12–15, 2026.
The Toronto-based company described the DS6005 as a co-packaged optics (CPO) switching system designed around the bandwidth density, power, latency, and reach requirements of next-generation AI data center networks. Celestica said the switch is purpose-built for AI and machine learning scale-up and scale-out networking, and that it reduces power consumption, lowers latency, and improves cluster efficiency and reliability in next-generation AI clusters.
Gavin Cato, Celestica’s senior vice president and general manager of portfolio solutions and AI platform engineering, said AI infrastructure is driving demand for bandwidth while power, thermal management, latency, and reach become increasingly important constraints. “The DS6005 brings co-packaged optics, liquid cooling, field-replaceable external laser modules, and CPO-aware software management together in a compact platform designed to help customers build scalable and power-efficient AI fabrics,” Cato said.
DS6005 Hardware and Design
The DS6005 places its optical engines directly on the switch ASIC package instead of using conventional front-panel pluggable optics. Celestica said the co-packaged layout is intended to help data center operators optimize bandwidth density, reduce latency, and improve power efficiency. The company listed 64 ports of 1.6TbE providing the system’s 102.4Tbps switching capacity, and said the fully liquid-cooled 1.5OU enclosure, designed for OCP ORv3 racks, improves temperature stability and reliability while increasing overall rack density. The switch also supports SONiC, which Celestica said enables faster time to production on a proven, open architecture.
The DS6005 product page lists an AMD Ryzen x86 CPU alongside the Broadcom TH6-Davisson chip. The 64 optical interconnects run through 16x 4x MMC-16 connectors, and the system also carries one 100GbE QSFP28 port, RJ45 console and out-of-band GbE management ports, one USB 3.0 Type A port, one USB-C console port, and 16 ELSFP interfaces for external laser modules. The unit complies with the ORv3-HPR rack specification.
On the product page, Celestica said the switch reduces link power consumption, delivers ultra-low latency, and reduces latency relative to retimed optics. The page names AI and machine learning scale-up and scale-out networks, high-performance computing, frontier cloud and enterprise domain AI models, and hyperscale cloud infrastructure as the deployment types the system is optimized for.
Broadcom’s Tomahawk 6 – Davisson Silicon
Broadcom announced on October 8, 2025 that it was shipping Tomahawk 6 – Davisson, its third-generation CPO Ethernet switch, which it described as the industry’s first to deliver 102.4Tbps of optically enabled switching capacity. For the BCM78919 device, Broadcom listed 16 Davisson DR optical engines of 6.4Tbps each, 200Gbps of bandwidth per link, field-replaceable ELSFP laser modules, and support for scale-up clusters of 512 XPUs as well as over 100,000 XPUs in two-tier networks at 200Gbps per link. According to Broadcom, the chip complies with IEEE 802.3 and interoperates with existing 400G and 800G standards.
Broadcom said TH6-Davisson heterogeneously integrates optical engines based on TSMC’s COUPE technology with advanced substrate-level multi-chip packaging, and reported a 70% reduction in optical interconnect power consumption, a level it described as more than 3.5 times lower than traditional pluggable solutions. Cato provided a supporting statement in that 2025 announcement, saying the chip’s optical integration, power efficiency, and performance aligned with Celestica’s strategy for next-generation AI infrastructure and workload deployments.
Supporting Statements and Summit Showcase
Manish Mehta, vice president of marketing and operations in Broadcom’s Optical Systems Division, said moving co-packaged optics from an advanced architecture to a production-ready system requires collaboration across silicon, optical engines, packaging, thermal design, manufacturing, and system integration. Mehta said Celestica’s system engineering and platform execution helped translate Broadcom’s technology into a platform designed for high-density AI fabrics.
Sameh Boujelbene, vice president of research at Dell’Oro Group, said AI networking is shifting the constraint from compute to the physical infrastructure around it, where power, density, reach, and deployment complexity increasingly matter. Boujelbene described co-packaged optics as one of the industry’s important paths to address those challenges, and said pluggable, near-package, and co-packaged approaches will continue to coexist as the ecosystem matures.
Alan Weckel, founder and technology analyst at 650 Group, said co-packaged optics is moving from an industry theme toward production for AI networking, with an important near-term opportunity in controlled, high-density scale-out fabrics. Cliff Grossner, chief innovation officer of the Open Compute Project Foundation, said open collaboration across silicon photonics, hardware, software, and management is essential to building scalable, interoperable AI fabrics that can be deployed and supported at scale.
Celestica said it will exhibit the DS6005 in booth C2 at the 2026 OCP Global Summit, which the Open Compute Project Foundation is holding October 12–15, 2026 in San Jose, California. The foundation’s event page states that the 2026 summit is sold out, that registration is closed, and that onsite registration will not be offered. Celestica directed readers to its event landing page for more information about its participation at the summit, which concludes October 15, 2026.
Auto-fetched and translated by AI Atlas. All rights belong to the original author.