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Ceva NeuPro NPU Family Reaches Production in Mobilint REGULUS Edge AI SoC 互联网档案馆的存檔，存档日期2013-12-02.
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2026年11月2日，Ceva 宣布，莫比林特将Ceva的SensPro AI DSP和NeuPro-Nano NPU部署在REGULUS，莫比林特的边缘AI系统对芯片中，Ceva称这是其NeuPro NPU家族的第一次生产部署。
Mobilint是一家无线AI半导体公司，成立于2019年，总部位于首尔，专长为NPU和AI SoC，用于边缘和端侧 AI应用。 Ceva公司为智能边缘设备发放硅和软件IP许可证，称公司的技术已运入超过220亿个设备，超过400个客户。
在法国足球俱乐部内部
作为端侧 AI的独立处理器设计，REGULUS将SensPro AI DSP和NeuPro-Nano NPN32 NPU整合到莫比林的处理架构中。 根据公告，芯片在3W以下交付了10超过的AI性能，并支持高达8GB的内存，Mobilint的REGULUS产品页面在17mm芯片上指定了密集的INT8计算。 设计目标是实时 AI在受动力和空间限制的应用中，包括机器人，无人机，机器视觉，智能相机和IOT设备。
多引擎架构为最适合每项任务的处理引擎分配了不同的感知和AI工作量。 SensPro为感知和信号处理工作量提供可编程的处理，而NeuPro-Nano为总是在推论中使用的个案处理神经处理，补充了Mobilint的专有AI处理架构。
除了推论外，SoC还包括一个内置的图像处理器，带有HDR和降噪，硬件视频编码每秒4K 60帧，以及摄像机，显示器，以太网，USB和传感器的直接连接。 Mobilint将REGULUS定位为运行Linux和没有主机的应用程序的完整处理器，而不是加速器。
在软件方面，Mobilint的SDK qb为芯片编译了PyTorch,TensorFlow和ONNX模型，称公司在CNN,RNN和变压器家族的硬件上验证了超过490个模型架构。 A Yocto Linux SDK包括GStreamer和OpenCV，提供相机，视频和显示驱动程序。
MLD-R1和REGULUS产品家庭
REGULUS已经为Mobilint的MLD-R1 AI USB加速器提供了电源，首先在 COMPUTEX 2026 进行预览，现在进行运输。 设计将端侧 AI添加到现有系统中，MLD-R1支持计算机视觉，视频分析以及基因AI工作量，用于智能工厂，机器人，机器视觉，安全，医疗器械和数字标志等应用，支持PyTorch,ONNX,Hugging Face,TensorFlow,TFLite和Keras框架。
Mobilint公司总裁称 Dongjoo Shin, Shin 称的Ceva IP 新增灵活感测，信号处理和工作量推断能力客户需要构建下一代智能边缘设备。
Mobilint以三种形式提供REGulUS：用于在自定义载体板上添加AI的MLM-1系统-on模块，用于基准和软件的REGulUS AI EVK评价工具包，以及用于在现有PC上添加AI的MLD-R1 USB-C Dongle. 公司列出了目标装置，包括用于生产线检查的AI摄像头，无人机，AI CCTV，机器人，亭台和航空航天平台。
称 REGULUS是Ceva的重要里程碑，是NeuPro NPU家族的首次生产部署，并补充说NeuPro-Nano和SensPro共同为当地需要实时操作的物理AI设备的工作量提供高效、灵活的感知和推论处理。
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Ceva NeuPro NPU Family Reaches Production in Mobilint REGULUS Edge AI SoC
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Ceva announced on November 2, 2026 that Mobilint has deployed Ceva’s SensPro AI DSP and NeuPro-Nano NPU in REGULUS, Mobilint’s edge AI system-on-chip, in what Ceva describes as the first production deployment of its NeuPro NPU family.
Mobilint is a fabless AI semiconductor company founded in 2019 and headquartered in Seoul, specializing in NPUs and AI SoCs for edge and on-device AI applications. Ceva licenses silicon and software IP for smart edge devices and says its technology has shipped in more than 22 billion devices for over 400 customers.
Inside the REGULUS SoC
Designed as a standalone processor for on-device AI, REGULUS integrates the SensPro AI DSP and the NeuPro-Nano NPN32 NPU within Mobilint’s processing architecture. According to the announcement, the chip delivers 10 TOPS of AI performance at under 3W and supports up to 8GB of memory, with Mobilint’s REGULUS product page specifying dense INT8 compute on a 17mm chip. The design targets real-time AI in power- and space-constrained applications including robotics, drones, machine vision, smart cameras and IoT devices.
The multi-engine architecture assigns different sensing and AI workloads to the processing engine best suited to each task. SensPro provides programmable processing for sensing and signal-processing workloads, while NeuPro-Nano handles neural processing for always-on inference use cases, complementing Mobilint’s proprietary AI processing architecture.
Beyond inference, the SoC includes a built-in image processor with HDR and noise reduction, hardware video encoding at 4K 60 frames per second, and direct connections for cameras, displays, Ethernet, USB and sensors. Mobilint positions REGULUS as a complete processor that runs Linux and applications without a host, rather than as an accelerator.
On the software side, Mobilint’s SDK qb compiles PyTorch, TensorFlow and ONNX models for the chip, and the company says more than 490 model architectures across CNN, RNN and transformer families have been validated on its hardware. A Yocto Linux SDK includes GStreamer and OpenCV, with camera, video and display drivers provided.
MLD-R1 and the REGULUS Product Family
REGULUS already powers Mobilint’s MLD-R1 AI USB accelerator, first previewed at COMPUTEX 2026 and now shipping. Designed to add on-device AI to existing systems, the MLD-R1 supports computer vision, video analytics and generative AI workloads for applications including smart factories, robotics, machine vision, security, medical devices and digital signage, with support for the PyTorch, ONNX, Hugging Face, TensorFlow, TFLite and Keras frameworks.
“REGULUS brings together the specialized processing capabilities needed to run sophisticated AI workloads directly on the device within very tight power constraints,” said Dongjoo Shin, CEO of Mobilint. Shin said the Ceva IP adds flexible sensing, signal processing and inference capabilities for the workloads customers need to build the next generation of intelligent edge devices.
Mobilint offers REGULUS in three forms: the MLM-1 system-on-module for adding AI to custom carrier boards, the REGULUS AI EVK evaluation kit for benchmarking and software bring-up, and the MLD-R1 USB-C dongle for adding AI to existing PCs. The company lists target devices including AI cameras for production-line inspection, drones, AI CCTV, robots, kiosks and aerospace platforms.
Yaron Galitzky, executive vice president and general manager of Ceva’s AI division, said REGULUS “marks an important milestone for Ceva as the first production deployment of our NeuPro NPU family,” adding that NeuPro-Nano and SensPro together provide efficient, flexible sensing and inference processing for the workloads physical AI devices need to perform locally and in real time.
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